CR200 - A Multi-Yoke Cropping Saw

CR200 -The World's Most Advanced Cropping Saw for 300mm silicon!

The saw was designed to orient the ingot and then cut the entire ingot and test wafers all at once, in a single cycle!

The CR200 table can accommodate silicon crystals of up to 2700 mm in length and up to 330 mm in diameter.

The CR200 comes standard with 5 yokes, an optional 6-yoke system is available.

Each Yoke has the ability to perform one crop cut, or one crop cut with two test wafers (simultaneously).

Diamond Materials Tech, Inc. - 3505 N. Stone Ave. - Colorado Springs, CO 80907 - USA
Phone (719) 570-1150 - Fax (719) 570-1176 - (800) 237-6792
Email: information@diamondwiretech.com